Thermal dissipation device

ABSTRACT

A thermal dissipation device includes a heat sink; and at least a heat pipe that pastes on the surface of the heat sink to conduct the thermal to the heat sink efficiently for thermal dissipation.

FIELD OF THE INVENTION

The present invention relates to a thermal dissipation device,especially to a thermal dissipation device used on the heatingelectrical components for thermal dissipation performance.

BACKGROUND OF THE INVENTION

Thermal dissipation devices are very popular in the electrical devices,such as a computer, which CPU has one thermal dissipation device (i.e.cooler) with a fan for increasing the heat conduction performance. Ifthe performance of the thermal dissipation device is not good, CPU willbe over heating and the processing speed of CPU will also be affected,or even forces this CPU burning out. Therefore, a good thermaldissipation device is a very important component for high efficiencyelectronic devices (such as a computer). FIG. 1 is the block diagram ofthe traditional thermal dissipation device. The upper side 11 of thethermal dissipation device usually connects with one fan, and the downside 12 usually connects with the heating electronic components (such asa CPU). The heat of the thermal dissipation device will be conductedoutside when the fan runs. The kernel part of this thermal dissipationdevice is solid, the surface of this thermal dissipation device isimplemented by several heat sink fins; when the fan runs, the thermaldissipation performance of these heat sink fins will be better, but thethermal of this thermal dissipation device is distributed from the solidkernel to the surface. At this situation, this solid kernel connectswith the electronic components with most heat, but the thermaldissipated by the fan is the least. That is, the fan cannot conduct thethermal effectively for this design of heat sink fins.

FIG. 2 is a block diagram of another conventional thermal dissipationdevice. This thermal dissipation device is assembled with several heatsink fins 22, several heat pipe 21 and base site 23. It is not easy toimplement this thermal dissipation device because heat pipe 21 has to bepassed through every heat sink fin 22 with high cost; and takes largerspace and inefficient thermal conduction.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide a new thermaldissipation device able to conduct thermal efficiently, increase thermaldissipation area, enhance the thermal dissipation performance, decreasespace and optimize the heat sink performance of the fan.

BRIEF DESCRIPTION OF THE INVENTION

According to the present invention, a thermal dissipation deviceincludes a heat sink; and at least a heat pipe that pastes on thesurface of the heat sink to conduct the thermal to the heat sinkefficiently for thermal dissipation.

In accordance with one aspect of the present invention, the thermaldissipation device also includes a base site to be connected with aheating electronic component.

In accordance with one aspect of the present invention, the heat sink ofthe thermal dissipation device is used to connect with a fan.

In accordance with one aspect of the present invention, the heat sink ofthe thermal dissipation device is cylindrical that is implemented byseveral heat sink fins.

In accordance with one aspect of the present invention, the heat pipe ofthe thermal dissipation device is soldered up the surface of the heatsink.

The present invention may best be understood through the followingdescription with reference to the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows the traditional thermal dissipation device;

FIG. 2 shows another traditional thermal dissipation device;

FIG. 3 shows the thermal dissipation device according to the presentinvention; and

FIG. 4 shows the detailed of the thermal dissipation device according tothe present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 3 shows the thermal dissipation device according to the presentinvention. The thermal dissipation device of the present inventionincludes a heat sink 31, a heat pipe 32, and a base site 33. Base site33 can be connected with one heating electronic component (which is notshown in the diagram), the heat pipe 32 is able to conduct the thermalof the electronic component to the heat sink 31. Heat sink 31 can becylindrical or any other shape, which is implemented by several heatsink fins. Due to the heat of electronic component is conducted from thebase site to the heat sink fins of the heat sink by the heat pipe, thethermal distribution of the heat sink is from external to internal withmore efficiently and easy to be fan out by the fan. Further more, thisdesign is able to generate the largest thermal surface but with thesmallest space to enhance the thermal performance. FIG. 4 shows thedetailed component diagram of the thermal dissipation device accordingto the present invention.

To sum up, the thermal dissipation device of the present invention is anewly advantaged design to conduct thermal efficiently, increase thermalsurface area, minimize the space, and enhance thermal performance of theheat sink and the fan. Any outlook modification, such as the number ofheat pipe or the shape of the heat sink, is included in the presentinvention if the heat pipe pasted on the external surface of the heatsink.

While the invention has been described in terms of what are presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention need not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

1. A thermal dissipation device including: a heat sink; and at least aheat pipe that pastes on the surface of said heat sink to conduct thethermal to said heat sink efficiently for thermal dissipation.
 2. Thedevice according to claim 1 wherein said thermal dissipation devicefurther includes a base site to be connected with a heating electroniccomponent.
 3. The device according to claim 1 wherein said heat sink ofsaid thermal dissipation device is used to connect with a fan.
 4. Thedevice according to claim 1 wherein said heat sink of said thermaldissipation device is cylindrical that is implemented by several heatsink fins.
 5. The device according to claim 1 wherein said heat pipe ofsaid thermal dissipation device is soldered up the surface of said heatsink.